PVD(物理气相沉积)是一种在真空环境下,利用物理方法将材料源(固体或液体)气化成原子、分子或使其部分电离成离子,然后通过低压气体(或等离子体)过程,在基体(工件)表面沉积具有特定功能的薄膜的技术。PVD涂层绿色环保,广泛应用于工具与模具、装饰与外观、半导体与微电子、光学器件、汽车、航空、医疗等。
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Atomic layer deposition (ALD) is a technique used to deposit thin films one atomic layer at a time. This technology is highly precise and offers excellent control over the film thickness.
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Chemical vapor deposition (CVD) is a process used to produce thin films through chemical reactions that occur when gas-phase precursors react on the substrate surface.
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